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Silicon Wafer Analyzer
SWA-256M
Contaminants on Silicon Wafers
Typical Organic Contaminants on Si Wafer
- Phthalates, e.g. DEP , DBP , DOP
- Organophorus, e.g. TBP,TCEP,TEP,TPP,TCP
- Antioxidants, e.g. BHT , oxide of BHT
-Siloxanes, e.g.cyclo siloxanes (D3 to D15)
- Adipates, e.g. DBA , DOA
- Amines
- Hydrocarbons
Standards of Organic Contaminants Method
- Silicon Wafer Surface £º ASTM F1982-99
- Outgassing : SEMI E108-0301
- JACA (Japan Air Cleaning Association) No.34-99
- Cleanroom £º ISO TC/209 WG8
(Molecular Contamination)
Schematic of TD-GC/MS
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ASTM approved TD-GC standard test method
ASTM F1982-99
- Standard Test Methods for Analyzing
- Organic Contami nants on Silicon
- Wafer Surfaces by Thermal
- Desorpti on Gas Chromatography
- Method A £º Performed on cleaved wafers
- Method B £º Performed on full wafers
SEMI Standard
- SEMI E108-0301
- Test Method for the assessment of Outgassing Organic Contamination
from Minienvironment s using Gas
- Chromatography/Mass Spectrosc opy
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SWA-256M Performance with standard sample
(Siloxane D6, BHT, TCEP, DBP, DOP)
SWA-256M Performance with standard sample
Linearity (Siloxane D6, BHT, TCEP, DBP, DOP)
Correlation coefficient (R 2 )
D6: 0.999 BHT : 0.997 TCEP : 0.994 DBP : 0.999 DOP : 0.998
Wafer box
1) Antioxidants
£ª BHT ¡æ 2,6-di-tert-butyl-p-Cresol £ª (Oxidized compounds of BHT)
a) 2,6-di-tert-butyl-p-Benzoquinone
b) 2,6-di-tert-butyl-p-Methaquinone
2) Bridging materials
£ª (Degradated compounds from Bis(t-butyl peroxi-isopropyl)benzene)
a) 1,3-Diisopropenylbenzene
b) p-Isopropenylacetophenone
c) Diacetylbenzene
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3) Plasticizers
Phthalic acid ester <(COOR) 2 C 6 H 6 >
£ª DBP ¡æ¡¡ Dibutyl phthalate £ª (Degradated compounds from DBP)
a) Phthalic anhydride b) Butanol
£ª DOP ¡æ¡¡ Di(2-ethyl-1-hexyl)phthalate £ª (Degradated compounds from DOP)
a) Phthalic anhydride
b) 2-ethyl-1-Hexanol
c) C 8 hydrocarbons
4) Unknown
£ª n-butyl-Benzenesulfonamide £ª 2-Octylthiophene |
Photolithography Process, Washing Process
Photolithography Process
1) HMDS ¡æ Hexamethyldisilazane
£ª (Degradated compounds from HMDS)
a) Trimethysilanol b) ammonium(undetection)
2) Photo resist solvent
£ª ECA ¡æ 2-ethoxyethyl acetate
3) Developing reagent
£ª (Degradated compounds from TMAH ¡æ Tetramethylammoniumhydroxide)
a) Trimethylamine
b) Diethylformamide
Washing Process
£ª IPA ¡æ Isopropanol
£ª Saturated hydrocarbons (C 14 ¢¦ C 20 ) |
Organic Contaminants on Si Wafer
from Wafer box storage
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Clean room
1) Plasticizers
Phthalic acid ester <(COOR) 2 C 6 H 6 >
£ª DBP ¡æ¡¡ Dibutyl phthalate
£ª (Degradated compounds from DBP)
a) Phthalic anhydride
b) Butanol
£ª DOP ¡æ¡¡ Di(2-ethyl-1-hexyl)phthalate
£ª (Degradated compounds from DOP)
a) Phthalic anhydride
b) 2-ethyl-1-Hexanol
c) C 8 hydrocarbons
£ª DEP ¡æ Diethyl phthalate
£ª DMP, DIBP, DHP, BBP, DNP
Adipic acid ester < (CH 2 ) 4( COOR) 2 >
£ª DBA ¡æ Dibutyl adipate
£ª DOA ¡æ Di(2-ethyl-1-hexyl)adipate
2) Fire retardants
Phospheric esters
£ª TCEP ¡æ Tris(2-chloroethyl)Phosphate
£ª TBP ¡æ Tributylphosphate
£ª TEP, TPP, TCP, TMCPP3
3) Sealants
Ring siloxanes Dn=[(CH 3 ) 2 SiO]n>
£ª Trimmers to 15-mers ( £Ä£³ to £Ä£±£µ )
4) Unknown
£ª Unsaturated hydrocarbon (C 16 , C 18 ) |
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